Heterogeneous processing in unmanned vehicles

ABSTRACT

A system-on-module (SOM) for controlling an unmanned vehicle (UV) is provided. The SOM comprises a circuit board, a first processing system in operative communication with the circuit board, and a second processing system in operative communication with the circuit board. The first processing system includes one or more first processing units and a volatile programmable logic array. The first processing system is configured to execute a first process for the UV. The second processing system includes one or more second processing units and a non-volatile programmable logic array. The second processing system is configured to monitor execution of the first process by the first processing system.

FIELD

The present disclosure relates generally to unmanned vehicles, and moreparticularly to control systems for unmanned vehicles.

BACKGROUND

An unmanned vehicle (UV) is a vehicle having no onboard pilot.Typically, UVs such as unmanned aerial vehicles (UAVs) are controlledremotely by a pilot, by onboard control systems, or by a combination ofa remote pilot and onboard control system. Most unmanned aerial vehiclesinclude a control system to control vehicle operations. Often, a controlsystem for a UAV includes one or more vehicle control systems includingonboard navigation systems such as inertial navigation systems andsatellite navigation systems. Unmanned aerial vehicles may use inertialnavigation sensors such as accelerometers and gyroscopes for flightpositioning and maneuvering and satellite-based navigation for generalpositioning and wayfinding. Most control systems additionally includeone or more mission control systems for performing one or more missioncontrol functions, such as capturing images or delivering a payload.Typically, individual hardware components are provided onboard a UAV foreach vehicle control system and each mission control system.

BRIEF DESCRIPTION

Aspects and advantages of the disclosed technology will be set forth inpart in the following description, or may be obvious from thedescription, or may be learned through practice of the disclosure.

According to example aspects of the present disclosure, there isprovided a system-on-module (SOM) for controlling an unmanned vehicle(UV), comprising a circuit board, a first processing system in operativecommunication with the circuit board, and a second processing system inoperative communication with the circuit board. The first processingsystem includes one or more first processing units and a volatileprogrammable logic array. The first processing system is configured toexecute a first process for the UV. The second processing systemincludes one or more second processing units and a non-volatileprogrammable logic array. The second processing system is configured tomonitor execution of the first process by the first processing system.

According to example aspects of the present disclosure, there isprovided a a system-on-module for controlling an unmanned vehicle (UV),comprising a first processing system including a first processing unitand a first programmable logic array, and a second processing systemincluding a second processing unit and a second programmable logicarray. The first processing unit is configured to execute a firstprocess and provide an output based on the first process. The secondprogrammable logic array is configured to enable control of the UV basedon the first process in response to a valid output of the firstprocessing system. The second programmable logic array is configured toexecute a second process and enable control of the UV based on thesecond process in response to an invalid output of the first processingsystem.

According to example aspects of the present disclosure, there isprovided a method that comprises monitoring, by a second processingsystem of a system-on-module of a control system for an unmanned vehicle(UV), execution of a first process by a first processing system of thesystem-on-module. The first processing system includes a firstprocessing unit and a nonvolatile programmable logic array. The secondprocessing system including a second processing unit and a volatileprogrammable logic array. The method comprises determining, by thesecond processing system, whether an output associated with execution ofthe first process by the first processing system is valid, andinitiating, by the second processing system, a first control action forthe UV based on a valid output associated with execution of the firstprocess and a second control action for the UV based on an invalidoutput associated with execution of the first process. The first controlaction and the second control action are different.

These and other features, aspects and advantages of the disclosedtechnology will become better understood with reference to the followingdescription and appended claims. The accompanying drawings, which areincorporated in and constitute a part of this specification, illustrateembodiments of the disclosed technology and, together with thedescription, serve to explain the principles of the disclosedtechnology.

BRIEF DESCRIPTION OF THE DRAWINGS

A full and enabling disclosure of the present disclosure, including thebest mode thereof, directed to one of ordinary skill in the art, is setforth in the specification, which makes reference to the appendedfigures, in which:

FIG. 1 is a block diagram depicting an example of an unmanned aerialvehicle (UAV) in which embodiments of the present disclosure may bepracticed;

FIG. 2 is a block diagram depicting an example of a typical controlsystem for a UAV including a backplane and card architecture;

FIG. 3 is a block diagram depicting an example of a UAV having anonboard control system according to example embodiments of the presentdisclosure;

FIG. 4 is a block diagram depicting a first circuit board comprising acontrol module for a control box of the onboard control system accordingto example embodiments of the present disclosure;

FIG. 5 is a block diagram depicting a first processing system of thefirst circuit board according to example embodiments of the presentdisclosure;

FIG. 6 is a block diagram depicting a second processing system of thefirst circuit board according to example embodiments of the presentdisclosure;

FIG. 7 is a block diagram depicting a second circuit board comprising acarrier module for the control box according to example embodiments ofthe present disclosure;

FIG. 8 is a block diagram depicting an example of partitioned operatingenvironments for a heterogeneous processing system according to exampleembodiments of the present disclosure;

FIG. 9 is a flowchart describing a process of monitoring, by a secondprocessing system, process execution at a first processing system;

FIG. 10 is a flowchart describing a process of initiating controlactions based on an output of a processing system;

FIG. 11 is a block diagram depicting an example of monitoring executionof processes by a first processing system and transferring control of avehicle function to a second processing system;

FIG. 12 is a perspective view of a control box in accordance withembodiments of the present disclosure;

FIG. 13 is a perspective view showing internal components of a controlbox in accordance with embodiments of the present disclosure;

FIG. 14 is an exploded perspective view of a control box in accordancewith embodiments of the present disclosure;

FIG. 15 is a perspective top view of a system-on-module circuit board inaccordance with embodiments of the present disclosure; and

FIG. 16 is a perspective bottom view of a system-on-module circuit boardin accordance with embodiments of the present disclosure.

DETAILED DESCRIPTION

Reference now will be made in detail to embodiments of the disclosure,one or more examples of which are illustrated in the drawings. Eachexample is provided by way of explanation, not limitation of thedisclosed embodiments. In fact, it will be apparent to those skilled inthe art that various modifications and variations can be made in thepresent disclosure without departing from the scope or spirit of theclaims. For instance, features illustrated or described as part ofexample embodiments can be used with another embodiment to yield a stillfurther embodiment. Thus, it is intended that the present disclosurecovers such modifications and variations as come within the scope of theappended claims and their equivalents.

As used in the specification and the appended claims, the singular forms“a,” “an,” and “the” include plural referents unless the context clearlydictates otherwise. The use of the term “about” in conjunction with anumerical value refers to within 25% of the stated amount.

Example aspects of the present disclosure are directed to systems andmethods for controlling unmanned vehicles (UV), and more particularly,to systems and methods for controlling unmanned vehicles and vehicledevices of the unmanned vehicles using a control system to provideintegrated vehicle and mission management control. In exampleembodiments, the control system includes a housing defining an interiorand one or more circuit boards disposed within the interior. Moreparticularly, the control system can include a first circuit boardhaving one or more integrated circuits that provide a first processingsystem and a second processing system. In example embodiments, the firstand second processing systems have heterogeneous field programmable gatearray architectures to provide diverse, configurable, and certifiable UVapplications.

In some examples, the first circuit board forms a control module for acontrol box and is configured to control vehicle and mission functionsfor a UV. For example, the second processing system can control a firstvehicle device or function of the UV based on execution of a firstmission or vehicle control process by the first processing system andexecution of a second mission or vehicle control process by the secondprocessing system.

The control system can additionally include a second circuit boarddisposed within the interior. The second circuit board may have one ormore additional integrated circuits and provide an interface between theadditional integrated circuits and the first and second processingsystems. In example embodiments, the integrated circuits of the secondcircuit board are interface circuits such as communication interfacecircuits that are adapted for coupling to vehicle devices via aplurality of sensor connectors of the second circuit board. The vehicledevices may include propulsion and movement devices, control surfaces,and sensors.

In some examples, the interface circuits can receive outputs of the viathe sensor connectors and provide vehicle device data to the firstcircuit board based on the device outputs. In some implementations, thefirst circuit board includes a first input/output (I/O) connector thatis coupled to a second I/O connector at the second circuit board. Thesecond circuit board may additionally include a third I/O connector thatextends from the housing of the control system. In some examples, thesecond circuit board is a carrier module configured to provide an I/Ointerface between vehicle devices of the UV in a first circuit boardsuch as a control module.

In various embodiments, the first circuit board may be configured toexecute a plurality of vehicle control processes as well as a pluralityof mission control processes. Additionally, the second circuit board canbe configured to provide an I/O interface between the UV and thesevehicle control processes and mission control process.

In example embodiments, the first processing system can include one ormore first processing units and a volatile programmable logic array suchas a RAM based field programmable gate array. The second processingsystem can include one or more second processing units and a nonvolatileprogrammable logic array such as a flash-based field programmable gatearray. In some implementations, the flash-based field programmable gatearray manages control of one or more vehicle devices of the UAV based ona first vehicle process executed by the one or more first processingunits and a second vehicle process executed by the one or more secondprocessing units.

In some examples, the first circuit board includes a first integratedcircuit comprising the first processing system and a second circuitboard comprising the second processing system. Each processing systemmay include one or more processing units such as central processingunits (CPU), application processing units (APU), real-time processingunits (RPU), co-processing processing units, and graphics processingunits (GPU). Additionally, each integrated circuit may include anembedded programmable logic array such as a field programmable gatearray (FPGA) forming an integrated part of the respective processingsystem.

In some examples, the first processing system and/or the secondprocessing system may each be provided as a multi-processing coresystem-on-a-chip. Together, two or more systems on chip configured withprocessing systems as described may provide a heterogeneous processingsystem for a UV.

In example embodiments of the disclosed technology, the first processingsystem and the second processing system cooperate to provide morereliable, robust, and/or certifiable UV applications. For example, thefirst processing system of the first circuit board can be configured toexecute a first process for the UV. The first process may be associatedwith a first vehicle device of the UV. The second processing system canbe configured to monitor execution of the first process by the firstprocessing system. Similarly, the first processing system can beconfigured to monitor execution of a process by the second processingsystem.

More particularly, in some examples one or more first processing unitsof the first processing system can be configured to execute a pluralityof vehicle management processes. A volatile programmable logic array ofthe first processing system can be configured to execute a plurality ofmission control processes. The nonvolatile programmable logic array ofthe second processing system can be configured to monitor execution ofone or more of the vehicle control processes by the one or more firstprocessing units.

In some examples, the second processing system is configured to initiateone or more control actions based on monitoring execution of the processby the first processing system. For example, the nonvolatileprogrammable logic array of the second processing system can beconfigured to monitor an output associated with the first processingsystem. In response to detecting an invalid output, the secondprocessing system can initiate a control action. By way of example, thenonvolatile programmable logic array may restart at least a portion ofthe first processing system based on an invalid output. In anotherexample, the logic array of the second processing system may restart oneor more processes by the first processing system. An invalid output mayinclude a lack of an output from a process or processing system, such asmay occur when a process or processing system faults, as well asunexpected signals or values provided as an output.

In some implementations, the second processing system can be configuredto transfer control of one or more UV functions based on monitoring thefirst processing system. For example, the second processing system maydetect an invalid output associated with a first process executed by thefirst processing system. In response, the second processing system maytransfer control of a function or device associated with the firstprocess to a second process. For instance, the second processing systemmay transfer control of a UV device or an autopilot function from thefirst processing system to the second processing system. In someexamples, the second processing system can be configured to execute thesecond process in response to detecting the invalid output.

Embodiments of the disclosed technology provide a number of technicalbenefits and advantages, particularly in the area of unmanned vehiclessuch as unmanned aerial vehicles. As one example, the technologydescribed herein enables control of an unmanned vehicle (UV) usingcompact and lightweight electronic solutions. Circuit boards havingintegrated heterogeneous processing systems enable reduced hardwareimplementations that provide multiple vehicle control processes andmission management processes for a UV. Additionally, such solutionsprovide backup functions and multiple fail point implementations thatcan meet the high certification requirements of airborne applications.Moreover, the integration of such heterogeneous processing systems intoa housing with one or more circuit boards that provide input/output(I/O) interfaces further enables reduced space and weight requirements.

Embodiments of the disclosed technology also provide a number oftechnical benefits and advantages in the area of computing technology.For example, the disclosed system can provide diverse computingenvironments to meet the various demands of UV applications. Multipleprocessing units spread across multiple integrated circuits provide arange of high speed processing options for application integration.Vehicle and mission control processes can be allocated to varioushardware and/or software partitions according to criticality andperformance needs. Moreover, embedded field programmable gate arraystightly coupled to these processing units via integration on a singleintegrated circuit with corresponding processing units providesadditional diversity and reliability.

FIG. 1 is a schematic view of an example unmanned aerial vehicle (UAV)UAV 10. UAV 10 is a vehicle capable of flight without an onboard pilot.For example, and without limitation, UAV 10 may be a fixed wingaircraft, a tilt-rotor aircraft, a helicopter, a multirotor droneaircraft such as a quadcopter, a blimp, a dirigible, or other aircraft.

UAV 10 includes a plurality of vehicle devices including at least onepropulsion and movement (PM) device 10. A PM device 14 produces acontrolled force and/or maintains or changes a position, orientation, orlocation of UAV 10. A PM device 14 may be a thrust device or a controlsurface. A thrust device is a device that provides propulsion or thrustto UAV 10. For example, and without limitation, a thrust device may be amotor driven propeller, jet engine, or other source of propulsion. Acontrol surface is a controllable surface or other device that providesa force due to deflection of an air stream passing over the controlsurface. For example, and without limitation, a control surface may bean elevator, rudder, aileron, spoiler, flap, slat, air brake, or trimdevice. Various actuators, servo motors, and other devices may be usedto manipulate a control surface. PM device 14 may also be a mechanismconfigured to change a pitch angle of a propeller or rotor blade or amechanism configured to change a tilt angle of a rotor blade.

UAV 10 may be controlled by systems described herein including, withoutlimitation, an onboard control system including a control box 100, aground control station (not shown in FIG. 1), and at least one PM device14. UAV 10 may be controlled by, for example, and without limitation,real-time commands received by UAV 10 from the ground control station, aset of pre-programmed instructions received by UAV 10 from the groundcontrol station, a set of instructions and/or programming stored in theonboard control system, or a combination of these controls.

Real-time commands can control at least one PM device 14. For example,and without limitation, real-time commands include instructions that,when executed by the onboard control system, cause a throttleadjustment, flap adjustment, aileron adjustment, rudder adjustment, orother control surface or thrust device adjustment.

In some embodiments, real-time commands can further control additionalvehicle devices of UAV 10, such as one or more secondary devices 12. Asecondary device 12 is an electric or electronic device configured toperform one or more secondary functions to direct propulsion or movementof the UAV. Secondary devices may be related to propulsion or movementof the UAV, but typically provide one or more vehicle or missionfunctions independent of direct control of vehicle propulsion or motioncontrol. For example, secondary devices may include mission-relateddevices such as cameras or other sensors used for object detection andtracking. Other examples of secondary devices 12 may include sensorssuch as LIDAR/SONAR/RADAR sensors, GPS sensors, communication devices,navigation devices, and various payload delivery systems. For example,and without limitation, real-time commands include instructions thatwhen executed by the onboard control system cause a camera to capture animage, a communications system to transmit data, or a processingcomponent to program or configure one or more processing elements.

UAV 10 is depicted by way of example, not limitation. Although much ofthe present disclosure is described with respect to unmanned aerialvehicles, it will be appreciated that embodiments of the disclosedtechnology may be used with any unmanned vehicle (UV), such as unmannedmarine vehicles and unmanned ground vehicles. For example, the disclosedcontrol systems may be used with unmanned boats, unmanned submarines,unmanned cars, unmanned trucks, or any other unmanned vehicle capable oflocomotion.

FIG. 2 is a block diagram depicting an example of a typical controlsystem 50 for a UAV. In this example, a control system is formed using abackplane 60 having a plurality of card slots 71, 72, 73, 74, 75. Eachcard slot is configured to receive a card meeting a predefined set ofmechanical and electrical standards. Each card includes one or morecircuit boards, typically including one or more integrated circuitsconfigured to perform specific vehicle or mission control functions. Thecard slot provides structural support for the card, as well as anelectrical connection between the card and an underlying bus. Aparticular example is depicted having a CPU card 61 installed in a firstcard slot 71, a co-processor card 62 installed in a second card slot 72,and add-on cards 63, 64, 65 installed in card slots 73, 74, 75,respectively. By way of example, CPU card 61 may include a circuit boardhaving a processor, PCI circuitry, switching circuitry, and anelectrical connector configured to both structurally and electricallyconnect card 61 to card slot 71. Similarly, co-processor card 62 mayinclude a processor, PCI circuitry, switching circuitry, and aconnector.

Add-on cards 63, 64, 65 may include any number and type of cardsconfigured to perform one or more vehicle and/or mission functions.Examples of add-on cards include input/output (I/O) cards, networkcards, piloting and navigation function cards, sensor interface cards(e.g., cameras, radar, etc.), payload delivery systems control cards,graphics processing unit (GPU) cards, and any other card for aparticular type of vehicle and/or mission function.

Typical backplane architectures like that in FIG. 2 include a switch 66that allows each card to communicate with cards in any other slot.Numerous examples including various standards exist to define differenttypes of backplane architectures. For example, although switch 66 isshown separate from the card slots 71, 72, 73, 74, 75, somearchitectures may place a central switch in a particular slot of thebackplane. In each case, the node devices can communicate with oneanother via the switch. While five card slots are depicted in FIG. 2, abackplane may include any number of card slots.

An onboard control system for a UAV utilizing a backplane architecturelike that of FIG. 2 may be effective in providing some function control.Additionally, such an architecture may provide some configurabilitythrough hardware changes. However, traditional backplane architecturesmay have a number of drawbacks in implementations for UAVs. For example,the structural performance of a backplane coupling to a plurality ofcards through a combined electrical and mechanical connection may not bewell-suited to the high-stress environments of some UAVs. Mechanicaland/or electrical failures may occur for one or more cards in thebackplane due to vibrations, temperatures, and other factors.Additionally, such architectures provide a limited processingcapability, while requiring considerable space and weight. Each cardtypically includes its own circuit board including connectors, switchingcircuitry, communication circuitry, etc. Because each circuit boardrequires its own circuitry for these common functions, a backplanearchitecture may provide relatively high weight and space requirements.Moreover, the computing ability and capacity of these types of systemsis typically limited by a multiple card approach. Communication betweenthe cards, and between the various processing elements may lead toreduced computational abilities.

FIG. 3 is a block diagram depicting an unmanned aerial vehicle (UAV) 10including a control system 80 in accordance with embodiments of thedisclosed technology. Control system 80 includes a control box 100 thatprovides centralized control of vehicle and mission functions. Thecontrol box includes a housing 110 defining an interior. A first circuitboard 120 and second circuit board 122 are disposed within the interiorof housing 110, and an I/O connector 126 extends from the second circuitboard 122 through the housing 110 as described hereinafter. Control box100 includes a heat sink 118 provided to dissipate heat from theelectric components of the control box 100. In example embodiments, heatsink 118 may form at least a portion of housing 110 as describedhereinafter. Control system 80 may include additional components such asadditional control units or other elements that perform vehicle ormission control processes.

In some implementations, first circuit board 120 comprises a controlmodule for controlling vehicle and mission control processes of UAV 103,and second circuit board 122 comprises a carrier module for providing acommunication interface between the control unit and various PM devicesand secondary devices of the UAV.

In some examples, the first circuit board includes multipleheterogeneous processing systems, each having a reconfigurableprocessing architecture to provide management of the various vehicle andmission functions. The multiple heterogeneous processing systems withreconfigurable functionality are suited to the diverse functionsperformed by unmanned airborne vehicles, as well as the high level ofcertifications typically needed for these vehicles.

In example embodiments, the second circuit board 122 is a carrier moduleproviding an interface between the first circuit board 120 and thevarious PM devices and secondary devices of UAV 10. For example, FIG. 3depicts a set of PM devices including a thrust device 30, controlsurface 32, and positioning system 34. Additionally, FIG. 3 depicts aset of secondary devices including an image sensor 20, a radar sensor22, a LIDAR sensor 24, a sonar sensor 26, a GPS sensor 28, a payloaddelivery system 36, and a communication system 38. The second circuitboard 122 may include an I/O connector that connects to a correspondingI/O connector of the first circuit board, as well as an I/O connectorthat extends from the housing. Additionally, the second circuit boardmay include a plurality of sensor connectors that extend from thehousing. The second circuit board may provide a communications orinput/output (I/O) interface including associated electronic circuitrythat is used to send and receive data. More specifically, thecommunications interface can be used to send and receive data betweenany of the various integrated circuits of the second circuit board, andbetween the second circuit board and other circuit boards. For example,the item interface may include I/O connector 126, I/O connector 238,and/or I/O connector 124. Similarly, a communications interface at anyone of the interface circuits may be used to communicate with outsidecomponents such as another aerial vehicle, a sensor, other vehicledevices, and/or ground control. A communications interface may be anycombination of suitable wired or wireless communications interfaces.

In some examples, control box 100 may include additional components. Forexample, a third circuit board such as a mezzanine card can be providedwithin control box 100 in another embodiment. The third circuit boardmay include one or more nonvolatile memory arrays in some examples. Forexample, a solid-state drive (SSD) may be provided as one or moreintegrated circuits on a mezzanine card. Moreover, control box 100 mayinclude additional circuit boards to form a control module as well asadditional circuit boards to form additional carrier modules.

FIG. 4 is a block diagram describing a first circuit board 120 inaccordance with example embodiments of the disclosed technology. In FIG.4, first circuit board 120 is configured as a control module (e.g.,control board) for an unmanned aerial vehicle (UAV). In exampleembodiments, first circuit board 120 is a system-on-module (SOM) card.First circuit board 120 includes a first processing system 230, secondprocessing system 232, memory blocks 234, and an I/O connector 238.

The first and second processing systems can include or be associatedwith, any suitable number of individual microprocessors, power supplies,storage devices, interfaces, and other standard components. Theprocessing systems can include or cooperate with any number of softwareprograms (e.g., vehicle and mission control processes) or instructionsdesigned to carry out the various methods, process tasks, calculations,and control/display functions necessary for operation of the aerialvehicle 10. Memory blocks 234 may include any suitable form of memorysuch as, without limitation, SDRAM, configured to support acorresponding processing system. For example, a first memory block 234may be configured to support first processing system 230 and a secondmemory block 234 may be configured to support second processing system232. Any number and type of memory block 234 may be used. By way ofexample, four memory blocks each comprising an individual integratedcircuit may be provided to support the first processing system 230 andtwo memory blocks may be provided to support the second processingsystem 232.

I/O connector 238 extends from a first surface of first circuit board122 to provide an operative communication link to second circuit board122.

First processing system 230 and second processing system 232 form aheterogeneous and reconfigurable computing architecture in exampleembodiments of the disclosed technology, suitable to the diverse andstable needs of UAV 10. First processing system 230 includes one or moreprocessing units 302 forming a first processing platform and one or moreprogrammable logic circuits 304 forming a second processing platform. Byway of example, one or more processing units 302 may include a centralprocessing unit and programmable logic circuit 304 may include avolatile programmable logic array such as a RAM-based field programmablegate array (FPGA). Any number and type of processing unit may be usedfor processing units 302. Multiple processing units 302 and programmablelogic circuit 304 may be provided within a first integrated circuit,referred to generally as a processing circuit in some embodiments.

Second processing system 232 includes one or more processing units 322forming a third processing platform and one or more programmable logiccircuits 324 forming a fourth processing platform. By way of example,one or more processing units 302 may include a co-processing unit andprogrammable logic circuit 324 may include a flash-based FPGA. Anynumber and type of processing unit may be used for processing units 324.One or more processing units 324 and programmable logic circuit 324 maybe provided within the second integrated circuit, also referred to as aprocessing circuit in some embodiments.

By providing different processing unit types as well as differentprogrammable logic circuit types in each processing system, firstcircuit board 120 provides a heterogeneous computing system uniquelysuited to the processing, reliability, and operational requirements ofhigh-stress application UAVs. For example, the RAM-based and flash-basedFPGA technologies are combined to leverage the strengths of both for UAVapplications. The unique abilities of heterogeneous processing units 302and 322 and heterogeneous programmable logic circuits 304 and 324support both hardware and software-partitioned operating environments.Vehicle and mission management functions can be allocated to differentpartitions according to criticality and performance needs. This providesa control and monitor architecture suitable for critical operations. Forexample, an on/off or red/green architecture for control of irreversiblecritical functions is provided. By way of further example, one or moreof the field programmable gate arrays may be configured to provide afabric accelerator for onboard sensor processing

FIG. 5 is a block diagram describing additional details of firstprocessing system 230 in accordance with example embodiments of thedisclosed technology. In FIG. 5, first processing system 230 includesthree processing units 302 as described in FIG. 4. More particularly,first processing system 230 includes an application processing unit(APU) 306, a graphics processing unit (GPU) 308, and a real-timeprocessing unit (RPU) 310. Each of processing units 306, 308, 310 may besupported by memory 312 which may include any number and type of memorysuch as an SDRAM. Each processing unit is implemented on an individualintegrated circuit referred to as a processing circuit. In one example,APU 306 is formed on a first processing circuit and includes a quad coreprocessing unit comprising four processors. RPU 310 is formed on a thirdprocessing circuit and includes a dual core processing unit comprisingtwo processors. GPU 308 is formed on a fourth processing circuit andincludes a single core processing unit. A second processing unit isprovided for the second processing system as described below. A switchfabric 316 connects the various components of processing system 230.Switch fabric 316, for example, may include a low-power switch and acentral switch in some examples. Communication interface 314 couplesfirst processing system 232 to first circuit board 120.

Programmable logic circuit 304 includes a volatile programmable logicarray 305. In example embodiments, logic array may include a RAM-basedprogrammable logic array such as a RAM-based floating point gate arrayincluding RAM logic blocks or memory cells. Volatile programmable logicarray 305 can be programmed with configuration data provided to thefirst processing system through communication interface 314. Forexample, a RAM-based FPGA can store configuration data in the staticmemory of the array, such as in an organization comprising an array oflatches. The logic blocks are programmed (configured) when programmablelogic circuit 304 is started or powered up. The configuration data canbe provided to logic array 305 from an external memory (e.g.,nonvolatile memory of first circuit board 120 or a mezzanine board asdescribed hereinafter) or from an external source of UAV 10 (e.g., usingsecond circuit board 122). A RAM-based FPGA provides high levels ofconfigurability and re-configurability. Although not shown, logic array305 may include various programmed circuits such as ethernet interfacesand PCI interfaces, and the various vehicle and mission managementprocesses described herein.

FIG. 6 is a block diagram describing additional details of secondprocessing system 232 accordance with example embodiments of thedisclosed technology. In FIG. 6, second processing system 232 includesan application processing unit (APU) 326 and memory 332. In one example,APU 326 is formed on a second processing circuit and includes a quadcore processing unit comprising four processors. Memory 332 may includeany number and type of memory such as SDRAM. A switch fabric 336connects the various components of processing system 232. Communicationsinterface 334 couples first processing system 232 to first circuit board120.

Programmable logic circuit 324 includes a nonvolatile programmable logicarray 325. In example embodiments, logic array 325 may include aflash-based programmable logic array such as a flash-based floatingpoint gate array including flash logic blocks or memory cells.Nonvolatile programmable logic array 325 can be programmed withconfiguration data provided to the second processing system throughcommunication interface 334. For example, a flash-based FPGA can storeconfiguration data in the nonvolatile memory of the array. Flash memoryis used as the primary resource for storage of the configuration datasuch that RAM-based memory is not required. Because the configurationdata is stored within the nonvolatile memory, there is no requirementfor reading the configuration data to the logic array upon startup orpower up. As such, the flash-based logic array may execute applicationsimmediately upon power up. Moreover, external storage of configurationdata is not required. The flash-based logic array can be reprogrammed orreconfigured by providing updated configuration data to override theconfiguration data presently stored in the logic array. The flash-basedlogic array may consume less power than the RAM-based logic array, aswell as provide more protection against interference. Although notshown, logic array 325 may include various programmed circuits, such asfor the various vehicle and mission management processes describedherein. In one example, logic array 325 may include at least one FPGAfabric accelerator for onboard sensor processing.

FIG. 7 is a block diagram depicting additional details of second circuitboard 122 in accordance with example embodiments of the disclosedtechnology. In FIG. 7, second circuit board 122 is configured as acarrier module (e.g., carrier card) for an unmanned aerial vehicle(UAV). Second circuit board 122 includes a plurality of integratedcircuits such as interface circuits providing I/O capabilities forcontrol box 100. The interface circuits are configured to receiveoutputs of the plurality of vehicle devices of the UAV via the sensorconnectors. The interface circuits provide vehicle device data based onoutputs of the vehicle devices to the first circuit board via I/Oconnector 124. Second circuit board 122 includes an I/O connector 126that extends from a housing of control unit 100 to provide an operativecommunication link to PM devices and secondary devices of UAV 10.Additionally, second circuit board 122 includes an I/O connector 124extending from a first surface of second circuit board 122 to provide anoperative communication link to first circuit board 120. Although notshown, second circuit board 122 may include an additional I/O connectorfor coupling to a mezzanine card including a solid-state drive, forexample. Any one or a combination of I/O connectors 126, 124, and 228may form an I/O interface between the interface circuits of the secondcircuit board and the first and second processing systems of the firstcircuit board.

FIG. 7 describes a particular set of interface circuits as may be usedin the particular implementation of control box 100. It will beappreciated, however, that any number and type of interface circuit maybe used as suited for a particular implementation. Second circuit board122 includes a plurality of interface circuits such as a LIDAR/SONARinterface 420, a Pitot/static interface 422, an electro-optical gridreference system (EOGRS) receiver interface 424, and a first circuitboard interface 432 for communicating with first circuit board 122.Second circuit board 122 also includes interface circuits such as asoftware defined radio 426, a navigation system 125, a controller areanetwork bus (CANBUS) 430, and a power supply 434. In some embodiments,navigation system 428 is an integrated circuit providing an integratednavigation sensor suite, including various sensors such as inertialmeasurement sensors. Additionally, second circuit board 122 includes anumber of interface circuits in operative communication with a pluralityof vehicle devices (e.g., PM devices or secondary devices) of the UAV10. A plurality of sensor connectors 458 extend from the housing ofcontrol unit 100 for coupling to the vehicle devices of UAV 10.

In the specific example of FIG. 7, one or more pulse width modulators(PWM) 402 are in operative communication with one or more servos 442 viaa first sensor connector 458. Although a PWM servo command interface isdepicted, other types of servo command interfaces may be used. Forexample, analog voltage, current loop, RS-422, RS-485, MIL-STD-1553 areall examples of possible servo control signals. A GPS receiver 404 is inoperative communication with one or more GPS antennas 444 via a secondsensor connector 458. GPS antennas 444 are one example of a GPS sensor28. A datalink receiver 406 is in operative communication with one ormore datalink antennas 446 via a third sensor connector 458. A serialreceiver link (SRXL) input 408 is in operative communication with aPilot in Command (PIC) receiver 448 via a fourth sensor connector 458. Aprogrammable power supply unit (PSU) 410 is in operative communicationwith a servo power 450 via a fifth sensor connector 458. One or morecomparators 412 are in operative communication with one or more discreteinputs 452 via a sixth sensor connector 458. One or more drivers 414 arein operative communication with one or more discrete outputs 454 via aseventh sensor connector 458. One or more analog-to-digital converters(ADC) 416 are in operative communication with one or more analog inputs456 via an eighth sensor connector 458.

FIG. 8 is a block diagram depicting an example of first circuit board120 in accordance with embodiments of the disclosed technology. FIG. 8depicts a specific implementation of first circuit board 120, as may beconfigured for a particular flight or mission. FIG. 8 depicts firstprocessing system 230 second processing system 232 as previouslydescribed. For clarity of description, only a subset of the componentsof processing systems 230 and 232 are depicted. A simplified version offirst processing system 230 is depicted including processing unit 302and volatile programmable logic array 305. Second processing system 232is depicted with processing units 322 and programmable logic array 305.

FIG. 8 depicts a plurality of partitioned operating environmentsPOE0-POE 7 created across the heterogeneous processing system. FIG. 8also depicts a specific allocation of vehicle and mission controlprocesses to further illustrate the disclosed subject matter.Specifically, a first partitioned operating environment POE0, a secondpartitioned operating environment POE1, and a third partitionedoperating environment POE2 are allocated at the one or more processingunits 302. In some examples, the partitioned operating environments arehardware partitions. For example, POE0 may be allocated at APU 306, POE1may be allocated at RPU 310, and POE2 may be allocated at GPU 308. Inother examples, the partitioned operating environments are softwarepartitions, such as different virtual machines virtualized from one ormore processing units. For example, one or more of APU 306, GPU 308, andRPU 310 may be virtualized to create the three partitioned operatingenvironments. A fourth partitioned operating environment POE3 isallocated to programmable logic array 305. Although a single operatingenvironment is depicted in FIG. 8, multiple operating environments mayalso be created within a programmable logic array. In one exampleindividual partitioned operating environments with her programmablelogic array represent different hardware elements such as differentlogic blocks. In other examples, virtualization or other softwaretechniques may be used to create individual partitioned operatingenvironments. Moreover, some embodiments include a combinedvirtualization of both processing unit 302 and programmable logic array305. Any number and combination of hardware processors and virtualmachines may be used to create individual partitioned operatingenvironments as depicted in FIG. 8.

In FIG. 8, one or more first vehicle control processes (VCP) 502 and oneor more first mission control processes (MCP) 504 are allocated to thefirst partitioned operating environment POE0. One or more VCPs 506 andone or more MCPs 508 are allocated to the second partitioned operatingenvironment POE1. One or more MCPs 510 are allocated to the thirdpartitioned operating environment POE2. One or more MCPs 512 areallocated to the fourth partitioned operating environment POE3.

FIG. 8 illustrates that a plurality of vehicle control processes andmission control processes may be allocated across multiple partitionedoperating environments to meet the needs of a particular implementation.For example, control processes may be categorized and the categoriesused to assign control processes to particular partitioned operatingenvironments. In some implementations, the first processing system canprovide at least two partitioned operating environments. Similarly, thesecond processing system can provide at least two partitioned operatingenvironments. For example, the first processing system may include ahigh integrity partition and a cluster partition. The high integritypartition may include real-time operating environment. Such an operatingenvironment may be configured for execution of one or more criticalvehicle navigation processes for example. Other processes may be placedinto the high integrity partition as well. The cluster partition mayinclude non-real-time operating environment. Such an operatingenvironment may be configured for execution of one or more missioncontrol processes. Other processes may be placed into the clusterpartition as well.

By way of specific example, POE0 may be used to execute critical controlprocesses. For instance, POE0 can be a high integrity partitionedincluding autopilot, guidance, and navigation processes withauto-generated code from a model based design flow. In one example, astandalone operating system can be used for a first partitionedoperating environment allocated for critical processes. POE1 may be usedto execute less critical, but time sensitive vehicle and mission controlprocesses. For example, mission navigation processes, datalinkmanagement processes, sensor data management processes, and/or groundstation/other C2 processes may be allocated to the second partitionedoperating environment. By way of further example, sensor processing andbackend parameter analysis of health and/or other parameters, etc. maybe allocated to the third partitioned operating environment POE2.Finally, a fourth partitioned operating environment POE3 may beallocated to high processing requirement applications such as imageanalysis and object detection and tracking. For example, sensor-relativenavigation and robotic perception/cognition may be performed in thefourth partitioned operating environment. In other examplesgeo-registration of sensor collection including targeting and alternatenavigation sources may be allocated to POE 3. Additionally, softwaredefined radio including signal intelligence collection and flexible datalinks for payload data dissemination may be allocated. In some examples,one or more of POE1, POE2, and POE3 may be a virtualized computingcluster form for mission control processes that are isolated from thehigh integrity partition. It will be appreciated that the examples areprovided by way of explanation only and numerous other optionsallocations may be made according to the requirements of a particularimplementation.

Referring to the second processing system 232, a fifth partitionedoperating environment POE4 may be allocated for additional vehiclecontrol processes. In some examples, POE4 may be used to executecritical and/or time sensitive vehicle control processes such as backupnavigation and piloting processes. The sixth partitioned operatingenvironment POE5 may be allocated for additional mission controlprocesses. In some examples, POE5 may be used to execute less criticalor time sensitive mission control processes. The seventh partitionedoperating environment POE6 is allocated to programmable logic array 325.In this example, POE6 is allocated for execution of one or more vehiclecontrol processes. By way of particular example, navigation monitoringand/or control processes may be configured in the seventh partitionedoperating environment POE6 in one embodiment. As described in moredetail hereinafter, one or more monitoring and/or control processes maybe implemented in POE6 in one implementation.

The heterogeneous processing system provided by first circuit board 120is uniquely situated to handle the diverse and high reliabilityrequirements of UAV's. More particularly, the heterogeneous processingsystem enables joint processing by two disparate processing systems toprovide monitoring, correction, and backup functions. For example, oneor more components of first processing system 230 may monitor executionof one or more processes at the second processing system 232 andgenerate control actions based on the monitor execution. Similarly, oneor more components of the second processing system 232 may monitorexecution of one or more processes at the first processing system 234and generate control actions based on the monitored execution. By way ofexample, the second processing system may detect one or more anomaliesassociated with execution of a process by the first processing systemand restart the process and/or the first processing system. By way ofadditional example, the second processing system may execute a backupprocess in response to a detected anomaly associated with the firstprocessing system. In yet another example, the second processing systemmay monitor an output of the first processing system and check for aconcurrence with an output of the second processing system. In responseto a concurrence, a control action such as enabling a vehicle device maybe initiated.

FIG. 9 is a flowchart describing a process 600 of joint processing of amanagement processes by a heterogeneous processing system in accordancewith embodiments of the disclosed technology. Although process 600describes monitoring by the second processing system execution of aprocess by the first processing system, it will be appreciated that theprocess may be similarly used by the first processing system to monitorexecution of the process by the second processing system. In oneexample, process 600 can be performed by a dedicated process within aprogrammable logic array of the processing system. In another example,process 600 may be performed by one or more processing units.

At (602), a first process is executed by the first processing system.For example, an application or other set of instructions can be executedby one or more processing units and/or the volatile programmable logicarray of the first processing system.

At (604), the second processing system monitors execution of the firstprocess at the first processing system. In some implementations,monitoring execution of a process includes monitoring an output of thefirst processing system. In other examples, monitoring execution of aprocess includes monitoring for one or more anomalies associated withexecution of the process by the first processing system.

At (606), the second processing system determines whether the output ofthe first processes is valid. In some examples, determining whether theoutput is valid includes determining whether the first processingsystems is generating the output. If the first processing system isgenerating an output, the second processing system determines that theoutput is valid. In another example, monitoring the output includesdetermining whether the output includes a valid signal. For example, thesecond processing system can determine whether the output includes asignal consistent with the first process being executed at the firstprocessing system. In another example, the second processing system candetermine whether the output matches or shares a concurrence withanother output. For instance, the second processing system can determinewhether the output of the first processing system matches or is the sameas an output of the second processing system in one example.

At (608), process 600 branches based on whether the output of the firstprocess was determined to be valid and/or shared a concurrence withanother output. If the output of the first process is determined to bevalid, a first control action is generated for the unmanned aerialvehicle at (610). If the output of the first process is determined to beinvalid, a second control action is generated for the unmanned aerialvehicle at (612). As described in more detail hereinafter, the firstcontrol action may include providing the output of the first process.The second control action may include restarting the first process orthe first processing system, executing a backup process, configuring anew process, or other suitable actions.

FIG. 10 is a flowchart describing a process 650 of initiating controlactions based on monitoring execution of a first processing system by asecond processing system or vice versa. More particularly, process 650describes second control actions that may be generated based on invalidoutput of the first processing system. For example, process 650 may beperformed by second processing system 232 at (612) of process 600 shownin FIG. 9.

At (652), process 650 determines whether the first process associatedwith the invalid output signal is associated with a high criticalityfunction of the UAV. For example, the second processing unit may takedifferent actions based on type of process for which an invalid outputwas detected. In this manner, the second processing system may beadapted to the particular requirements of various implementations. In aparticular example, all vehicle control processes may be considered tobe associated with high criticality vehicle functions. Similarly, asubset of mission management processes such as navigation or certainsensor data management may be considered to be associated with highcriticality functions.

If the control action is being initiated in response to a highcriticality function, process 652 continues at (654). At (654), a backupprocess for the first process is executed by the second processingsystem. In some examples, the second processing system executes thebackup process in one or more processing units 322. In other examples,the second processing system executes the backup process in programmablelogic circuit 324.

At (656), function control is transferred to the backup process. Forexample, the second processing system can transfer control of the highcriticality function from the first process to the backup process. Itwill be appreciated that the backup process may be executed by thesecond processing system prior to detecting an invalid output. Forexample the backup process may already be executing in the secondprocessing system. In response to an invalid output from the firstprocessing system, function control can be transferred to the backupprocess.

After transferring function control to the backup process, or inresponse to determining that the function is not a high criticalityfunction, process 650 continues at 658. At (658), process 650 determineswhether the first processing system has been compromised. For example,the second processing system can determine whether the invalid output isassociated with an unauthorized modification of the first process at thefirst processing system. In some examples, the second processing systemmay detect an unauthorized modification in response to unexpectedoutputs of the first processing system. In other examples, the secondprocessing system may detect an unauthorized modification by thepresence of malicious code.

If the first processing system has been compromised, process 650continues at (664). At (664), the second processing system obtainsupdated configuration data and/or an updated instruction set for theprimary process. The updated configuration data may be obtained locallyfrom memory 332 for example, or remotely from information transmitted bya ground station for example.

At (666), the first processing system is reconfigured and/orpreprogrammed based on the updated configuration data and/or instructionset. For example, the second processing system may transmit an updatedconfiguration data file and/or instruction set to the first processingsystem. One or more processing units of the first processing system canbe reprogrammed and/or the programmable logic array can be reconfigured.In some examples, the primary process can be reconfigured to avoid asubsequent unauthorized modification of the first processing system. Forexample, the primary process can be modified to avoid a subsequentexploit of a vulnerability that may have been used to have initiallycompromised the first processing system.

At (670), function control is transferred back to the first processingsystem. In some examples, (670) includes transferring function controlfrom the backup process to the reconfigured primary process.

If the first processing system is not compromised, process 650 continuesat (660). At (660), process 650 restarts the first processing system orrestarts execution of the first process by the first processing system.For example, the second processing system may restart execution of thefirst process or restart the first processing system in its entirety inan effort to alleviate the cause of the invalid output. For example, theinvalid output may be detected as a loss of the output signal due to apower or other failure of the first processing system. Restarting thefirst processing system or the first process may again cause the outputto be validly generated. At (662), function control is transferred tothe primary process if function control was earlier transferred to thebackup process at (656).

FIG. 11 is a block diagram depicting first circuit board 120 and amonitoring process that can be performed by second processing system 232in accordance with example embodiments of the disclosed technology. Inanother example, a similar process may be performed by first processingsystem 230.

First processing system 230 is depicted with real-time processing unit(RPU) 310 executing a primary control process for a first UAV function.By way of example, the primary control process may include a firstinstruction set stored in memory and executed by RPU 310. Primarycontrol process 702 generates an output 722 that is provided to one ormore support processes 704. Support processes 704 are associated withthe first UAV function. By way of example, the primary control processmay be an autopilot process configured to generate output commands fornavigating of piloting the UAV based on sensor data. The one or moresupport processes 704 may include a pulse width modulation (PWM) servocommand generation unit. The PWM servo command generation unit mayreceive the commands from a first output 722 of the autopilot processand generate as an output 724, the appropriate PWM servo commands. Inanother example, the primary control process 702 may be a payloaddelivery control process. Although PWM servo commands are described, anytype of servo command signal and servo command generation unit may beused, such as serial data bus, analog phase/amplitude, etc.

Second processing system 232 includes one or more support processes 708that are also associated with the first UAV function. By way of example,support processes 708 may include a de-serializer process in someexamples. The deserializer process may receive serial PWM servo commandsand generate PWM commands that can be stored in the buffer. Supportprocesses 708 provide an output 726 to process monitor/controller 710.Process monitor/controller 710 is configured to determine whetherprimary control process 702 is generating a valid output. In oneexample, process monitor/controller 710 is configured to determinewhether an output 726 is received from support processes 708 in order todetermine whether the primary control process 702 is generating an afirst output 722. In another example, process monitor/controller 710 isconfigured to determine whether an output 724 is received by supportprocesses 708 in order to determine whether the primary control process702 is generating a first output 722 that is valid. In another example,process monitor/controller 710 is configured to determine whether thecontent of output 726 is valid in order to determine whether firstoutput 722 is valid. If process monitor/controller 710 determines thatthe first output 722 is valid, an output 728 is provided. In oneexample, output 728 includes PWM servo commands received from supportprocesses 708.

Support processes 708 are further configured to receive a second output732 from a backup control process 706 executed by APU 326 of the secondprocessing system 232. For example, backup control process 706 may be abackup autopilot process or a backup payload delivery process. Supportprocesses 708 may receive commands from the backup autopilot process andgenerate PWM servo commands in one example. Support processes 708generate an output 734 which is provided to process monitor/controller710. If process monitor/controller 710 determines that the output 722 ofthe primary control process 702 is invalid, it can generate an output736 including the output 732 of the backup control process.

In some implementations, processor monitor/controller 710 may determinewhether the first output 722 of the first processing system 230 is validbased on comparing the first output to the second output 732 from thesecond processing system. For example, process monitor/controller 710can determine whether the first output 722 and the second output 732match or are otherwise have a concurrence. If there is a concurrencebetween the first output 722 and the second output 732, the processormonitor/controller 710 may determine that the first output 722 is valid.

FIG. 11 is a specific example where process monitor/controller 710enables a backup control process 706 in response to an invalid outputassociated with the primary control process 702. In other examples,process monitor/controller 710 can be configured to enable a vehicledevice or initiate a particular function based on the output of aprocess executed by each processing system. For example, a payloaddelivery system may be enabled or activated based on a concurrencebetween an output generated by the first processing system and an outputgenerated by the second processing system.

Referring now to FIGS. 12 through 16, further embodiments of improvedcontrol boxes 100 and components thereof are generally provided. Asdiscussed, control box 100 in accordance with the present disclosuregenerally houses the various electrical/computing components whichcontrol operation of an unmanned aerial vehicle (“UAV”), and the controlbox 100 is thus generally mounted on the UAV. Control boxes 100 inaccordance with the present disclosure are particularly advantageous dueto their modular design, wherein various components of the control boxes100 such as the heat sink, cover, and/or stiffener, as discussed herein,are each interchangeable with various different designs for each suchcomponent. Certain features as discussed herein help to facilitate suchmodularity. Additionally, as discussed herein, various features of suchcontrol boxes 100 such as the heat sink, the stiffener, and the systemon module (“SOM”) circuit board include advantageous heat transferfeatures for transferring heat from the SOM circuit board and from thecontrol box 100 generally. Other advantageous features will be discussedherein.

A control box 100 in accordance with the present disclosure may define alateral direction 102, a longitudinal direction 104, and a transversedirection 106, as shown. Such directions 102, 104, 106 may togetherdefine an orthogonal coordinate system for the control box 100.

Control box 100 may include a housing 110 which defines an interior 112.The housing 110 in exemplary embodiments includes a cover 114 and one ormore stiffeners 116. In some embodiments, only a single stiffener 116 isutilized in a control box 100, although in alternative embodiments morethan one stiffener 116 may be utilized. In embodiments wherein thehousing 110 includes a cover 114 and stiffener(s) 116, at least one suchstiffener 116 is removably connected in contact with the cover 114, andthe stiffeners 116 are stacked on each other and the housing 110 alongthe transverse direction 106. Control box 100 may further include a heatsink 118. The heat sink 118 may be removably connected to the housing110, such as in contact with one of the plurality of stiffeners 116. Theheat sink 118 may further be stacked on the stiffeners 116 and thehousing 110 along the transverse direction 106.

One or more circuit boards may be disposed within the interior 112. Forexample, a first circuit board 120 may be disposed in the interior 112.In exemplary embodiments, the first circuit board 120 is a system onmodule (“SOM”) circuit board such as the example SOM circuit board 200as discussed herein. Such first circuit board 120 may in exemplaryembodiments be positioned between the housing 110 and the heat sink 118,such as between a stiffener 114 and the heat sink 118. Further, thefirst circuit board 120 may be in contact with the heat sink 118 suchthat heat from the first circuit board 120 is dissipated from the firstcircuit board 120 through the heat sink 118. Additionally, the firstcircuit board 120 may be in contact with a stiffener 114.

For example, the first circuit board 120 may include one or morecomputing components. Such computing components may include a firstprocessing system 230, a second processing system 232, and/or one ormore memory blocks 234, all of which are discussed in detail herein,such as in the context of SOM circuit board 200. Further, a thermalinterface material 236 (discussed in detail below in the context of SOMcircuit board 200) may be disposed on one or more of such computingcomponents. In exemplary embodiments, the first circuit board 120, suchas the thermal interface material 236 disposed on one or more of thecomputing components, may contact the heat sink 118 and/or a stiffener116.

In some embodiments, the thermal interface material 236 may be incontact with the heat sink 118. In particular, the thermal interfacematerial 236 that is disposed on one or more computing components (suchas first processing system 230, a second processing system 232, and/orone or more memory blocks 234 that are mounted on a first face surface210 of the circuit board 120 as discussed below in the context of theSOM circuit board 200) may be in contact with the heat sink 118, such asa base 130 thereof.

Additionally or alternatively, the stiffener 116 may include a pluralityof fingers 140. Fingers 140 are generally planer inner surfaces of thestiffener 116 which contact other components for support and heattransfer purposes. The first circuit board 120 may contact such fingers140. In particular, the thermal interface material 236 that is disposedon one or more computing components (such as one or more memory blocks234 that are mounted on a second face surface 212 of the circuit board120 as discussed below in the context of the SOM circuit board 200) maybe in contact with the fingers 140.

In exemplary embodiments, the stiffener 116 includes an outer frame 142and one or more cross-members 144. Stiffener 116 may additionallyinclude fingers 140. When first circuit board 120 contacts stiffener116, the first circuit board 120 may contact the outer frame 142 and/orone or more of the cross-members 144, and may further contact fingers140 as discussed above.

In exemplary embodiments, heat sink 118 is formed from a metal. Heatsink 118 may include a base 130. Base may in exemplary embodiments be incontact with the first circuit board 120, such as components thereof asdiscussed above. Further, in some exemplary embodiments (not shown),heat sink 118 may include a plurality of fins 132 which extendexternally from the base 130. In these embodiments, heat sink 118 mayprovide convective heat transfer from the control box 100 via fins 132.In other embodiments, as illustrated in FIGS. 12-14, no fins 132 may beprovided and heat sink 118 may provide conductive heat transfer from thecontrol box 100 via contact of the base 130 with other components in,for example, the subject UAV to which the control box 100 is mounted. Instill other embodiments, heat sink 118 may further include single use orreversible phase change materials, liquid cooling materials, and/orother suitable components for facilitating heat transfer.

Control box 100 may further include a second circuit board 122. Secondcircuit board 122 may, for example, be a carrier card-type circuit boardwhich generally includes communications related components, such assonar, radar, GPS, radio, etc. related components, including variousintegrated circuits forming interface circuits. The second circuit boardmay be disposed within the interior 112. For example, such secondcircuit board 122 may in exemplary embodiments be positioned between thecover 114 and the stiffener 116. Further, the second circuit board 122may be in contact with the stiffener 116.

In exemplary embodiments, second circuit board 122 is in operativecommunication with first circuit board 120. For example, second circuitboard 122 may further include one or more input/output connectors 124which are positioned on the second circuit board 122 to operativelycontact mating input/output connectors (such as connectors 238 in SOMcircuit board 200 embodiments) of the first circuit board 120.

In some embodiments, second circuit board 122 may further include one ormore sensor connectors 125. Such sensor connectors 125 may extend fromthe housing 110, such as along the longitudinal direction 104 as shownin FIGS. 12 through 14 or in another suitable direction. These sensorconnectors 125 may be ports for connection of the second circuit board122 to suitable external sensors or other secondary devices 12 (such asthose discussed herein) which may, for example, be mounted on the UAV onwhich the control box 100 is mounted.

Control box 100 may additionally include one or more input/outputconnectors 126 which extend from the housing 110. In exemplaryembodiments, one or more of such connector(s) 126 are components of thesecond circuit board 122. Such input/output connectors 126 may connectthe control box 100 and components thereof to other components of, forexample, the UAV on which the control box 100 is mounted. In someembodiments, as illustrated in FIGS. 12-14, the input/outputconnector(s) 126 extend from the housing 110 along the longitudinaldirection 104, such as through an end faceplate 115 of the housing 110.In other embodiments, the input/output connector(s) 126 extend from thehousing 110 along the transverse direction 106, such as through thecover 114.

In some embodiments, control box 100 may further include a mezzaninecard 128. Mezzanine card 128 may be disposed within interior 112, andmay be in operative communication with the second circuit board 122.Mezzanine card 128 may, for example, be disposed between second circuitboard 122 and cover 114. In some embodiments, one or more of theinput/output connectors 126 are components of the mezzanine card 128.

As shown, the heat sink 118 and components of the housing 110 mayinclude through-holes. The various through-holes may advantageouslyalign to facilitate the modularity of the various components of controlbox 100. For example, a plurality of through holes 150 may extendthrough the base 130 of heat sink 118, such as along the transversedirection 106. Such through holes 150 may be arranged in a pattern.Further, a plurality of through holes may extend through the housing110, such as along the transverse direction 106. Such through holes maybe arranged in a pattern. Such through holes may, for example, includethrough holes 152 which extend through the cover 114 along thetransverse direction 106 and in a pattern, and through holes 154 whichextend through the stiffener 116 along the transverse direction 108 andin a pattern. In exemplary embodiments, the patterns of through holes inthe base 130 and housing 110, such as the through holes 150, 152, and154, are identical. Accordingly, fasteners may be inserted through thethrough holes 150, 152, 154 to fasten such components of the control box100 together. Notably, such identical pattern may extend to a variety ofdifferent types of heat sinks 118 and housings 110 (and covers 114 andstiffeners 116 thereof), such that different versions of such componentscan be swapped with each other in a module fashion.

When the heat sink 118 contacts the housing 110, such as the stiffener116 thereof, such components may fit together using a“tongue-and-groove” type feature. Such feature advantageously orientsthe components relative to one another to ensure a proper fit, and alsoadvantageously acts as an electro-magnetic interference (“EMI”) filter.

Referring now to FIGS. 15 and 16, a control box 100 in accordance withthe present disclosure may include a system on module (“SOM”) circuitboard 200, which may be the first circuit board 120 as discussed above.The SOM circuit board 200 may define a lateral direction 202, alongitudinal direction 204, and a transverse direction 206, as shown.Such directions 202, 204, 206 may together define an orthogonalcoordinate system for the SOM circuit board 200. When the SOM circuitboard 200 is installed in a control box 100, the directions 202, 204,206 may correspond to the respective directions 102, 104, 106.

SOM circuit board 200 may have a main body 208 which includes aplurality of outer surfaces. For example, main body 208 includes a firstface surface 210 and a second opposing face surface 212, both of whichgenerally extend within planes defined by the lateral direction 202 andlongitudinal direction 204. Main body 208 further includes a first endsurface 214 and an opposing second end surface 216, both of whichgenerally extend within planes defined by the lateral direction 202 andthe transverse direction 206. Main body 208 further includes a firstside surface 218 and an opposing second side surface 220, both of whichgenerally extend within planes defined by the longitudinal direction 204and the transverse direction 206.

In generally, the SOM circuit board 200 and main body 208 thereof has ahyperrectangular shape, as shown. Accordingly, first and second endsurface 214, 216 also each have a length 222, which is a maximum lengthalong the lateral direction 202. First and second side surfaces 218, 220each also have a length 224, which is a maximum length along thelongitudinal direction 204. As shown, in exemplary embodiments, themaximum lengths 224 are greater than the maximum lengths 222.

The SOM circuit board 200 may further include a plurality of computingcomponents. Each computing component may be mounted on the main body208, such as on the first face surface 210 or second face surface 212.For example, the computing components may include a first processingsystem 230, a second processing system 232, and a plurality of memoryblocks 234. Notably, the first and second processing systems 230, 232and the memory blocks 234 may in exemplary embodiments be integratedtogether in a cohesive computing system with the two processing systems230, 232 operating together. Accordingly, for example, the firstprocessing system 230 can monitor and back up the second processingsystem 232 and the second processing system 232 can monitor and back upthe first processing system 230.

In some embodiments, for example, the first processing system 230 may bea random access memory (“RAM”) based processing system. Additionally oralternatively, the second processing system 232 may in some embodimentsbe a flash memory-based processing system. Additionally oralternatively, the memory blocks 234 may be RAM memory blocks.

As shown, in exemplary embodiments, the first and second processingsystems 230, 232 may be mounted on the first face surface 210 of themain body 208. Alternatively, however, one or both of the first andsecond processing systems 230, 232 may be mounted on the second facesurface 212 of the main body 208. Further, in some embodiments, at leastone or more of the memory blocks 234 may be mounted on the first facesurface 210. Additionally or alternatively, at least one or more of thememory blocks 234 may be mounted on the second face surface 212.

In some embodiments, a thermal interface material 236 may be disposed onone or more of the computing components. The thermal interface material236 may facilitate heat transfer from such computing components to othercomponents of the control box 100, as discussed herein. Suitable thermalinterface materials 236 may, for example, be relatively compliantmaterials which may for example be curable. In exemplary embodiments,such materials 236 may be thixotropic materials. In exemplaryembodiments, such materials 236 may have a thermal conductivity ofbetween 3.2 and 4 W/m-K, such as between 3.4 and 3.8 W/m-K, such as 3.6W/m-K. One suitable materials is Gap Filler 3500S35, which iscommercially available from The Bergquist Company.

In exemplary embodiments, the thermal interface material 236 may bedisposed on the memory blocks 234, such as one or more of the memoryblocks 234 mounted on the first face surface 210 and/or one or more ofthe memory blocks 236 mounted on the second face surface 212.Additionally or alternatively, the thermal interface material 236 may bedisposed on the first processing system 230 and/or the second processingsystem 232.

One or more input/output connectors 238 may additionally be mounted onthe main body 208. These connectors 238 may connect the SOM circuitboard 200 to other circuit boards, as discussed herein, in the controlbox 100, thus allowing communication between the SOM circuit board 200and such other circuit boards. The connectors 238 may, for example, bemounted on the second face surface 212 as shown, or alternatively may bemounted on the first face surface 210. In some embodiments, theconnectors 238 may be disposed proximate the first side surface 218, andthus closer to the first side surface 218 than the second side surface220 along the lateral direction 202. In some of these embodiments, noconnectors 238 may be provided proximate the second side surface 220.Further, longitudinal axes of the connectors 238 may be aligned alongthe longitudinal direction 204, as shown.

As further illustrated, a plurality of mounting holes 240 may extendthrough the main body 208. One or more of these mounting holes 240 may,for example, be utilized to connect the SOM circuit board 200 to othercomponents in the control box 100. Each mounting hole 240 may extendalong the transverse direction 206 through and between the first facesurface 210 and the second face surface 212.

The locations of the mounting holes 240 in the main body may beparticularly advantageous. For example, a first array 242 of themounting holes 240 may be disposed proximate the first side surface 218,and in exemplary embodiments between the connectors 238 and the firstside surface 218 along the lateral direction 202. The mounting holes 240of the first array 242 may be spaced apart from each other along thelongitudinal direction 204. In exemplary embodiments, the first array242 may include three or more mounting holes, although in alternativeembodiments two mounting holes may be utilized. A second array 244 ofthe mounting holes 240 may be disposed proximate the second side surface220, and in exemplary embodiments may be spaced along the lateraldirection 202 an equal distance from the second side surface 220 as thefirst array 244 is from the first side surface 218. The mounting holes240 of the second array 244 may be spaced apart from each other alongthe longitudinal direction 204. In exemplary embodiments, the secondarray 244 may include three or more mounting holes, although inalternative embodiments two mounting holes may be utilized. The firstand second arrays may advantageously both connect the SOM circuit board200 to other components in the control box 100 and minimize any relativemotion of the SOM circuit board 200 with respect to such components.

Additionally, one or more third mounting holes 246 may be disposedbetween the first array 242 and the second array 244 along the lateraldirection 202. In exemplary embodiments, the one or more third mountingholes 246 may be positioned generally centrally between the first sidesurface 218 and the second side surface 220, such as along the lateraldirection 202. The third mounting holes 246 may this be equally spacedfrom the first array 242 and the second array 244 along the lateraldirection 202. Further, in embodiments wherein only a single thirdmounting hole 246 is utilized, the third mounting hole 246 may bepositioned generally centrally between the first end surface 214 and thesecond end surface 216, such as along the longitudinal direction 204.The third mounting hole(s) 246 may be particularly advantageous, as suchhole(s) 246 reduce resonant frequency issues during use of the SOMcircuit board 200 and provide improved stiffness to the SOM circuitboard 200.

In some embodiments, a plurality of vias 250 may be provided in SOMcircuit board 200. Each via may extend through the body 208 along thetransverse direction 206, and may protrude from the first face surface210 and/or second face surface 212. Vias 250 may be located proximatethe first side surface 218 and/or the second side surface 220. Vias 250may in exemplary embodiments be formed from a metallic material, such asgold or copper, and may serve as heat transfer conduits to transfer heatfrom within the main body 208 and transfer this heat from the main body208 and SOM circuit board 200 generally.

In some embodiments, one or more metallic coatings may be plated on themain body 208, such as on the first face surface 210 and/or second facesurface 212 thereof. The metallic coatings may serve as heat transferconduits to transfer heat from the main body 208 and SOM circuit board200 generally.

For example, a first metallic coating 252 may be plated on portions ofthe body 208 (such as on the first face surface 210 and/or second facesurface 212 thereof) defining the plurality of mounting holes 240(including those mounting holes in the first and second arrays 242, 244as well as the third mounting hole(s) 246. Such coating 252 may bediscretely plated on such portions of the body 208, such that thevarious platings are not connected. In exemplary embodiments, such firstmetallic coating 252 is a copper coating, although in alternativeembodiments gold or other suitable metals may be utilized.

Additionally or alternatively, a second metallic coating 254 may beplated the body 208 (such as on the first face surface 210 and/or secondface surface 212 thereof). Such coating 252 may be located proximate thefirst and second side surfaces 218, 220, and may extend to such surfaces218, 220, such as entirely along the length 224. In embodiments whereinboth first and second metallic coatings 252, 254 are utilized, thesecond metallic coating 254 may be plated over the first metalliccoating 252. In exemplary embodiments, such second metallic coating 254is a gold coating, although in alternative embodiments copper or othersuitable metals may be utilized.

Some embodiments of the disclosed technology may be implemented ashardware, software, or as a combination of hardware and software. Thesoftware may be stored as processor readable code and implemented in aprocessor, as processor readable code for programming a processor forexample. In some implementations, one or more of the components can beimplemented individually or in combination with one or more othercomponents as a packaged functional hardware unit (e.g., one or moreelectrical circuits) designed for use with other units, a portion ofprogram code (e.g., software or firmware) executable by a processor thatusually performs a particular function of related functions, or aself-contained hardware or software component that interfaces with alarger system, for example. Each hardware unit, for example, may includean application specific integrated circuit (ASIC), a Field ProgrammableGate Array (FPGA), a circuit, a digital logic circuit, an analogcircuit, a combination of discrete circuits, gates, or any other type ofhardware or combination thereof. Alternatively or in addition, thesecomponents may include software stored in a processor readable device(e.g., memory) to program a processor to perform the functions describedherein, including various mission and vehicle control processes.

Processing units can include any number and type of processor, such as amicroprocessor, microcontroller, or other suitable processing device.Memory device(s) can include one or more computer-readable media,including, but not limited to, non-transitory computer-readable media,RAM, ROM, hard drives, flash drives, or other memory devices.

Memory blocks 234 and other memory described herein may can storeinformation accessible by one or more processing units or logic array,including computer-readable instructions that can be executed by the oneor more processor(s). The instructions can be any set of instructionsthat when executed by a processor, cause the processor to performoperations. The instructions can be software written in any suitableprogramming language or can be implemented in hardware. In someembodiments, the instructions can be executed by a processor to causethe processor to perform operations, such as the operations forcontrolling vehicle and/or mission functions, and/or any otheroperations or functions of a computing device.

The technology discussed herein makes reference to computer-basedsystems and actions taken by and information sent to and fromcomputer-based systems. One of ordinary skill in the art will recognizethat the inherent flexibility of computer-based systems allows for agreat variety of possible configurations, combinations, and divisions oftasks and functionality between and among components. For instance,processes discussed herein can be implemented using a single computingdevice or multiple computing devices working in combination. Databases,memory, instructions, and applications can be implemented on a singlesystem or distributed across multiple systems. Distributed componentscan operate sequentially or in parallel.

Although specific features of various embodiments may be shown in somedrawings and not in others, this is for convenience only. In accordancewith the principles of the present disclosure, any feature of a drawingmay be referenced and/or claimed in combination with any feature of anyother drawing.

This written description uses examples to disclose the claimed subjectmatter, including the best mode, and also to enable any person skilledin the art to practice the claimed subject matter, including making andusing any devices or systems and performing any incorporated methods.The patentable scope of the disclosed technology is defined by theclaims, and may include other examples that occur to those skilled inthe art. Such other examples are intended to be within the scope of theclaims if they include structural elements that do not differ from theliteral language of the claims, or if they include equivalent structuralelements with insubstantial differences from the literal languages ofthe claims.

What is claimed is:
 1. A system-on-module (SOM) for controlling anunmanned vehicle (UV), comprising: a circuit board; a first processingsystem in operative communication with the circuit board, the firstprocessing system including one or more first processing units and avolatile programmable logic array, the first processing systemconfigured to execute a first vehicle control process for the UV; and asecond processing system in operative communication with the circuitboard, the second processing system including one or more secondprocessing units and a non-volatile programmable logic array, thenon-volatile programmable logic array configured to monitor execution ofthe first vehicle control process by the first processing system.
 2. Thesystem-on-module of claim 1, wherein: the one or more first processingunits are configured to execute a plurality of vehicle control processesincluding the first vehicle control process; and the volatileprogrammable logic array is configured to execute a plurality of missioncontrol processes.
 3. The system-on-module of claim 1, wherein: thesecond processing system is configured to restart at least a portion ofthe first processing system in response to an invalid output associatedwith the first processing system.
 4. The system-on-module of claim 1,wherein: the second processing system is configured to execute a secondvehicle control process for the UV, the second vehicle control processbeing different than the first vehicle control process; and the firstprocessing system is configured to monitor execution of the secondvehicle control process by the second processing system.
 5. Thesystem-on-module of claim 1, wherein: the second processing system isconfigured to restart execution of the first vehicle control process bythe first processing system in response to an invalid output associatedwith the first vehicle control process executed by the first processingsystem.
 6. The system-on-module of claim 1, wherein: the first vehiclecontrol process is associated with a first vehicle device of the UV; andthe second processing system is configured to execute a second vehiclecontrol process and transfer control of the first vehicle device to thesecond vehicle control process in response to an invalid outputassociated with the first vehicle control process executed by the firstprocessing system.
 7. The system-on-module of claim 1, wherein: the oneor more first processing units are configured to execute the firstvehicle control process; and the one or more second processing units areconfigured to execute a second vehicle control process.
 8. Thesystem-on-module of claim 7, wherein: the first vehicle control processincludes a first set of processor-readable instructions comprising aprimary system; and the second vehicle control process includes a secondset of processor-readable instructions comprising a backup system. 9.The system-on-module of claim 8, wherein: the non-volatile programmablelogic array includes a multiplexer and a control state machine; thecontrol state machine is configured to enable the backup system inresponse to a loss of a valid output between the one or more firstprocessing units and the non-volatile programmable logic array.
 10. Thesystem-on-module of claim 1, wherein: the volatile programmable logicarray is a RAM-based field programmable gate array (FPGA); thenon-volatile programmable logic array is a flash-based FPGA.
 11. Thesystem-on-module of claim 8, wherein: one or more random-access memory(RAM) based memory devices associated with the first processing system,the one or more RAM based memory devices configured to store the firstset of processor-readable instructions; and one or more read-only memory(ROM) based memory devices associated with the second processing system,the one or more ROM based memory devices configured to store the secondset of processor-readable instructions.